With the rapid development of semiconductor technology, chips, as the core carrier of information technology, have become the key to promoting technological progress by improving their performance and quality. However, chips inevitably experience aging during long-term use, which directly affects the performance and lifespan of electronic products. Therefore, chip aging testing has become a crucial link in the semiconductor industry. This article will delve into the challenges faced by chip aging testing and introduce a semiconductor testing probe that can easily break through.

Chip aging testing is the process of comprehensively testing and evaluating chips by simulating actual working conditions under long-term use and various extreme environments. Its goal is to verify the stability and reliability of the chip under long-term use and extreme conditions. However, this testing process faces many challenges:

High testing complexity: With the continuous improvement of chip integration, the complexity and difficulty of aging testing are also increasing. Testers need to simulate various environmental factors, such as high temperature, low temperature, high humidity, etc., to verify the stability of the chip in different environments.

Long testing time: Aging testing requires a long period of operation to evaluate the lifespan and performance degradation of the chip. This not only consumes a lot of time and resources, but also places extremely high demands on testing equipment and environment.

High testing accuracy requirements: In order to ensure the accuracy of test results, aging testing requires high-precision testing equipment and probes. Any small error can lead to deviation in test results, thereby affecting the assessment of chip performance.

 

Faced with the many challenges of chip aging testing, a high-performance semiconductor testing probe has become the key to breaking through.Semiconductor high-frequency probe, also known as dual head probe, is used to physically connect with the contact points of the chip through tiny probes after the chip manufacturing is completed, transmit test signals to the chip interior, and read feedback data.

 

Semiconductor testing needles are mainly used for various communication power electronic components, semiconductor wafer testing, chip packaging testing, and other processes. With extremely low contact resistance and ultra-high bandwidth, they can meet the testing requirements of 5-40G high-frequency signals.

At present, Centalic can process the minimum probe diameter: needle diameter: 0.06mm/needle tube diameter: 0.10mm.